MB-SiC

Bond
  • Wire
  • Slurry
Size

5.0 / 7.5 / 10 µm

Shape

Angular

Our angular diamond with controlled oversize is tailored for precision and efficiency. Perfect for slurry wire cutting, it excels in SiC wafer cutting, semiconductor manufacturing, and photovoltaic applications. Achieve outstanding results with our specialized diamond solutions!

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M-PCD

Bond
  • HPHT synthesis
Size

0 - 80 µm

Shape

Blocky

Our high-toughness, blocky diamond is ultra-clean and free of inclusions, making it the perfect choice for PCD/PDC synthesis. Designed for demanding applications like drilling inserts and cutting tools, it delivers exceptional durability and performance. Discover the reliability of our premium diamond solutions today!

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M-WD

Bond
  • Wire
  • Slurry
Size

50 - 500 nm - 5 - 70 µm

Shape

Angular

Our high-toughness, angular diamond is engineered for precision and durability. Ideal for diamond wire applications, it excels in solar (5–7 µm), stone (50–70 µm), silicon, glass, and magnetic cutting. Experience superior cutting performance with our expertly designed diamond solutions!

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AS-G

Bond
  • Metal
  • Vitrified
Size

0 - 80 µm

Our as-grown diamond is a high-toughness, full-crystal solution designed for heavy-duty grinding applications. With exceptional durability, it excels in ceramics and metal bond systems. If you’re seeking a robust diamond material for demanding tasks, discover the unmatched performance of our as-grown diamond today!

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NANO

Bond
  • Slurry
  • Suspension
Size

50 - 500 nm

Our nano and sub-micron monocrystalline diamond features a narrow particle size distribution (PSD), ensuring precision and consistency. Perfectly suited for semiconductor wafers, optics, and ultra-fine finishing applications, it delivers exceptional performance for the most demanding tasks. Explore our nano and sub-micron solutions for unparalleled results!

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